All stock codes associated to this product
STApogeeGTZ, ST-ApogeeGTZ
The Apogee GTZ has an entirely new design that pushes and refines both thermal and mechanical specifications to the limits of today's technology.
The thermal design of the cooling engine combines the benefits of direct coolant impingement over the CPU area with an entirely new copper base plate design which is primarily characterized by a pin matrix composed of 225 m (0.009") micro structures. This results in a 20% improvement in thermal resistance compared to the Apogee GTX.
When the Apogee GTZ is integrated in an actual system, the hydraulic pressure drop remains well within the efficiency range of current high-pressure pumps such as the MCP350 or MCP655 as illustrated in the graph below:
The mechanical design of the copper base plate is optimized for Intel socket LGA 775 and 771. The assembly features a patent pending design characterized by a topographically mapped CPU contact area which results in a 75% and up to 300% improvement in TIM joint thermal resistance compared to the Apogee GT/GTX series. Other types of sockets such as AMD socket F, AM2, and 940 as well as upcoming sockets similar in design to that of socket 775 may also benefit from the enhanced contact area.
An enhanced tool free retention system using thumb-nuts paired with a universal socket 775 motherboard back-plate guarantee high quality, safe and repeatable mounts.
The Apogee GTZ is shipped with an Intel Core 2 (socket 775) compatible hold-down plate and complies with socket 775 keep-out specification, thus guaranteeing compatibility with all socket 775 type motherboards.
