All stock codes associated to this product
KHX16LC9K4/32X
KHX16LC9K4/32X
32GB (8GB 1G x 64-Bit x 4 pcs.)
DDR3L-1600 CL9 240-Pin DIMM Kit
DESCRIPTION
Kingston's KHX16LC9K4/32X is a kit of four 1G x 64-bit (8GB) DDR3L-1600 CL9 SDRAM (Synchronous DRAM), 2Rx8, low voltage, memory modules, based on sixteen 512M x 8-bit FBGA components per module. Each module kit supports
Intel ®XMP (Extreme Memory Profiles). Total kit capacity is 32GB. Each module kit has been tested to run at DDR3L-1600 at a low latency timing of 9-9-9 at 1.35V. The SPD is programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. This 240-pin DIMM uses gold contact fingers. The JEDEC standard electrical and mechanical specifications are as follows:
XMP TIMING PARAMETERS
JEDEC: DDR3-1600 CL11-11-11 @1.5V
XMP Profile #1: D3-1600 CL9-9-9 @1.35V
FEATURES
- JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
- VDDQ = 1.5V (1.425V ~ 1.575V)
- 800MHz fCK for 1600Mb/sec/pin
- 8 independent internal bank
- Programmable CAS Latency: 11, 10, 9, 8, 7, 6
- Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
- 8-bit pre-fetch
- Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
- Bi-directional Differential Data Strobe
- Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE< 95°C
- Asynchronous Reset
- PCB : Height 1.180” (30.00mm), double sided component
SPECIFICATIONS
- CL(IDD) 11 cycles
- Row Cycle Time (tRCmin) 48.125ns (min.)
- Refresh to Active/Refresh 260ns (min.)
- Command Time (tRFCmin)
- Row Active Time (tRASmin) 35ns (min.)
- Maximum Operating Power 2.580 W* (per module)
- UL Rating 94 V - 0
- Operating Temperature 0oC to 85oC
- Storage Temperature -55oC to +100oC
Power will vary depending on the SDRAM used.
