All stock codes associated to this product
HX430C15PBK4/32, 740617240733
HX430C15PBK4/32
32GB (8GB 1G x 64-Bit x 4 pcs.)
DDR4-3000 CL15 288-Pin DIMM
DESCRIPTION
HyperX HX430C15PBK4/32 is a kit of four 1G x 64-bit (8GB) DDR4-3000 CL15 SDRAM (Synchronous DRAM) 2Rx8, memory module, based on sixteen 512M x 8-bit FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Total kit capacity is 32GB. Each module has been tested to run at DDR4-3000 at a low latency timing of 15-16-16 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2133 timing of 15-15-15 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The JEDEC standard electrical and mechanical specifications are as follows:
XMP TIMING PARAMETERS
JEDEC: DDR4-2133 CL15-15-15 @1.2V
XMP Profile #1: DDR4-3000 CL15-16-16 @1.35V
XMP Profile #2: DDR4-2666 CL14-14-14 @1.35V
FEATURES
Power Supply: VDD=1.2V Typical
VDDQ = 1.2V Typical
VPP - 2.5V Typical
VDDSPD=2.2V to 3.6V
Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
Low-power auto self refresh (LPASR)
Data bus inversion (DBI) for data bus
On-die VREFDQ generation and calibration
Dual-rank
On-board I2 serial presence-detect (SPD) EEPROM
16 internal banks; 4 groups of 4 banks each
Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
Selectable BC4 or BL8 on-the-fly (OTF)
Fly-by topology
Terminated control command and address bus
Height 1.230 (31.25mm), w/o heatsink
SPECIFICATIONS
CL(IDD): 15 cycles
Row Cycle Time (tRCmin): 46.5ns(min.)
Refresh to Active/Refresh: Command Time (tRFCmin): 260ns(min.)
Row Active Time (tRASmin): 33ns(min.)
Maximum Operating Power: TBD W*
UL Rating: 94 V - 0
Operating Temperature: 0oC to +85oC
Storage Temperature: -55oC to +100oC
