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All stock codes associated to this product
HX426S15IBK2/16
HX426S15IBK2/16
16GB (8GB 1Gx 64-Bit x 2 pcs.)
DDR4-2666 CL15 260-Pin SODIMM Kit
DESCRIPTION
HyperX HX426S15IBK2/16 is a kit of two 1G x 64-bit (8GB) DDR4-2666 CL15 SDRAM (Synchronous DRAM) 2Rx8, memory modules, based on sixteen 512M x 8-bit DDR4 FBGA compo-nents. Total kit capacity is 16GB. Each module supports Intel Extreme Memory Profiles (Intel XMP) 2.0. This module has been tested to run at DDR4-2666 at a low latency timing of 15-15-15 at 1.2V. Additional timing parameters are shown in the PnP Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:
Note:
The PnP feature offers a range of speed and timing options to support the widest variety of processors and chipsets. Your maximum speed will be determined by your BIOS.
PnP JEDEC TIMING PARAMETERS:
Note: The PnP feature offers a range of speed and timing options to support the widest variety of processors and chipsets. Your maximum speed will be determined by your BIOS.
FEATURES
Power Supply: VDD = 1.2V Typical
VDDQ = 1.2V Typical
VPP - 2.5V Typical
VDDSPD = 2.25V to 3.6V
On-Die termination (ODT)
16 internal banks; 4 groups of 4 banks each
Bi-Directional Differential Data Strobe
8 bit pre-fetch
Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
Height 1.18 (30.00mm)
JEDEC/PnP: DDR4-2666 CL15-15-15 @1.2V
DDR4-2400 CL14-14-14 @1.2V
DDR4-2133 CL13-13-13 @1.2V
XMP Profile #1: DDR4-2666 CL15-15-15 @1.2V
Specifications
CL(IDD): 15 cycles
Row Cycle Time (tRCmin): 45ns (min.)
Refresh to Active/Refresh, Command Time (tRFCmin): 260ns (min.)
Row Active Time (tRASmin) 26.25ns (min.)
Maximum Operating Power TBD W*
UL Rating: 94 V - 0
Operating Temperature 0C to 85C
Storage Temperature -55C to +100C