All stock codes associated to this product
HX424C15FB2K4/32, 3238654, 740617256574
Overview
HyperX HX424C15FB2K4/32 is a kit of four 1G x 64-bit (8GB) DDR4-2400 CL15
SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 1G x 8-bit FBGA
components per module. Each module kit supports Intel Extreme Memory Profiles
(Intel XMP) 2.0. Total kit capacity is 32GB. Each module has been tested to run
at DDR4-2400 at a low latency timing of 15-15-15 at 1.2V. Additional timing
parameters are shown in the Plug-N-Play (PnP) Timing Parameters section below.
The JEDEC standard electrical and mechanical specifications are as follows:
Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will be
determined by your BIOS.
JEDEC/XMP TIMING PARAMETERS
- JEDEC/PnP:
- DDR4-2400 CL15-15-15 @1.2V
- DDR4-2133 CL14-14-14 @1.2V
- XMP Profile #1:
- DDR4-2400 CL15-15-15 @1.2V
Features
- Power Supply: VDD = 1.2V Typical
- VDDQ = 1.2V Typical
- VPP - 2.5V Typical
- VDDSPD = 2.2V to 3.6V
- Nominal and dynamic on-die termination (ODT) for data, strobe, and mask
signals
- Low-power auto self refresh (LPASR)
- Data bus inversion (DBI) for data bus
- On-die VREFDQ generation and calibration
- Single-rank
- On-board I2 serial presence-detect (SPD) EEPROM
- 16 internal banks; 4 groups of 4 banks each
- Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode
register set (MRS)
- Selectable BC4 or BL8 on-the-fly (OTF)
- Fly-by topology
- Terminated control command and address bus
- Height 1.340 (34.04mm), w/heatsink
Specifications
CL(IDD) |
15 cycles |
Row Cycle Time (tRCmin) |
46.75ns(min.) |
Refresh to Active/Refresh Command Time
(tRFCmin) |
350ns(min.) |
Row Active Time (tRASmin) |
29.125ns(min.) |
Maximum Operating Power |
TBD W* |
UL Rating |
94 V - 0 |
Operating Temperature |
0 degree celcius to +85 degree celcius |
Storage Temperature |
-55 degree celcius to +100 degree
celcius |