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Part Number:
62711
(?) Brand:
Manuf No:
CL-P0268
CLP0268
Shipping Weight:
1 KG (Includes product packaging)
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Date Added:
All stock codes associated to this product
CLP0268, CL-P0268
Best performance, supports up to TDP 130W
Heatsink Details:
6 heatpipes maximises heat transfer
All copper structure, provides extremely fast heat conductivity
0.2mm thick copper fins and perfect fin rate provides perfect weight-to-performance ratio
Waved fins to reduce wind shearing noise
 
3 in 1 application
For LGA775: push pin design for faster install
For K8 and latest socket AM2, tool-less clip, easy to install

No additional files, specification sheets, guides or documentation found for product.

Full manufacturers warranty details are available at the manufacturers (ThermalTake) web site.

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L7: 1 | TM: 0 | LM: 4 | TY: 11 | T: 1989
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