All stock codes associated to this product
CLP0268, CL-P0268
Best performance, supports up to TDP 130W
Heatsink Details:
6 heatpipes maximises heat transfer
All copper structure, provides extremely fast heat conductivity
0.2mm thick copper fins and perfect fin rate provides perfect weight-to-performance ratio
Waved fins to reduce wind shearing noise
3 in 1 application
For LGA775: push pin design for faster install
For K8 and latest socket AM2, tool-less clip, easy to install