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OCZ DDR3 PC3-12800 / 1600 MHz / Reaper HPC Edition / 4GB / Dual Channel
The DDR3 Reaper HPC Series offers perfect compatibility with the latest platforms and chipsets, are now available in 4GB dual channel kit to meet the specific needs of customized gaming systems or workstations, offering perfect compatibility with the latest platforms and chipsets at the height of DDR3 performance.
To ensure superior stability and performance over the entire life of the memory the Reaper HPC Series makes use of an innovative cooling solution to more effectively dissipate heat produced by high-speed memory. The thermo-conductive copper heat pipe conduit is ideal for overclocking where every degree matters, ensuring that your cutting-edge investment will maintain its integrity throughout the toughest gaming missions, overclocking, or intense program applications.
The PC3-12800 Reaper HPC Series will be available in 4GB (2x2048MB) Dual Channel Kit. As part of OCZ's line-up of premium memory, Reaper HPC modules are backed by a Lifetime Warranty so you can push your high-performance memory to its limit.
With an excellent balance of high densities, high speeds, and tight timings, the latest additions to the DDR3 Reaper HPC Series will future-proof your system with the performance and stability enthusiasts have come to expect from OCZ.
* All Modules are tested in two module kits. Due to additional bus load, four module configurations may have to be run at lower frequency and relaxed latencies for stable operation. Test specifications are based on dual core CPUs only. If quad core CPUs are used, higher bus thresholds and core arbitration may necessitate lowering the memory frequency below tested specs.
**The Reaper HPC series uses heat pipe technology to rapidly remove heat from the main body of the memory modules and conduct the thermal load to the extended radiator fin array. The addition of the extended fin array nearly doubles the total surface area available for heat dissipation while the heat pipes warrant near isothermicity throughout the entire design. The result is a doubling in effective heat dissipation at equal delta t or, in real systems, a significantly lower operating temperature of the memory modules.
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