CPUF-K666 | Dynatron K666 2U+ CPU Cooler - Intel LGA1155, 1156, 1150, 60mm

Features

CPU Socket Skylake LGA 1151, Haswell LGA1150 and LGA1155/1156 CPU Support LGA 1155: Intel® 2nd Generation Coreâ„¢ i7-2600, i5-2500 series & Sandy Bridge Xeon® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280 LGA1156: Intel® Coreâ„¢ i3 i3-530 & i3-540, Coreâ„¢ i5 i5-650, i5-650,  i5-660, i5-661 i5-670 & I5-750; Xeon® Processor 3400 Series; Coreâ„¢ i7 Processors, I7-870 & I7-860 Solution 2U&Up Server Overall Dimension 90.7 x 85.0 x 64.0 mm Weight 500 g Material Copper Base & Aluminum Fins with Heatpipes embedded Fan Dimension 60 x 60 x 25 mm Speed At Duty Cycle 0~20%: 1600 RPM
At Duty Cycle 50%: 2300 RPM
At Duty Cycle 100%: 5000 RPM Bearing 2 Ball Bearing Rated Voltage 12 V Power At Duty Cycle 0~20%: 0.72 W
At Duty Cycle 50%: 1.2 W
At Duty Cycle 100%: 3.0 W Air Flow At Duty Cycle 0~20%: 8.5 CFM
At Duty Cycle 50%: 12.2 CFM
At Duty Cycle 100%: 26.45 CFM Noise Level At Duty Cycle 0~20%: 13.8 dBA
At Duty Cycle 50%: 21.8 dBA
At Duty Cycle 100%: 38.7 dBA Air Pressure At Duty Cycle 0~20%: 0.75 mm-H2O
At Duty Cycle 50%: 1.55 mm-H2O
At Duty Cycle 100%: 7.32 mm-H2O Lead Wire Pin Out Pin1-Black (-)
Pin2-Yellow (+)
Pin3-Green (Tachometer/Signal output)
Pin4-Blue (PWM) Thermal Resistance & Noise Level VS. Cooling Fan Speed Note 1. Thermal Grease Pre-Printed with GE-Toshiba TIG830SP
2. RoHS Compliance