Essentials |
|
Capacity |
2
TB |
Status |
Launched |
Launch
Date |
Q2'17 |
Lithography
Type |
3D
NAND TLC |
Recommended
Customer Price |
N/A |
|
|
Performance |
|
Sequential
Read (up to) |
3200
MB/s |
Sequential
Write (up to) |
1575
MB/s |
Random
Read (100% Span) |
610000
IOPS |
Random
Write (100% Span) |
196650
IOPS |
Latency
- Read |
85
µs |
Latency
- Write |
15
µs |
Power
- Active |
Sequential
Avg. 17W (Write), 9.4W (Read) |
Power
- Idle |
<5
W |
|
|
Reliability |
|
Vibration
- Operating |
2.17
GRMS |
Vibration
- Non-Operating |
3.13
GRMS |
Shock
(Operating and Non-Operating) |
50
G Trapezoidal, 170 in/s |
Operating
Temperature Range |
0°C
to 35°C |
Endurance
Rating (Lifetime Writes) |
11.08
PBW |
Mean
Time Between Failures (MTBF) |
2
million hours |
Uncorrectable
Bit Error Rate (UBER) |
<1
sector per 10^17 bits read |
Warranty
Period |
5
yrs |
|
|
Package
Specifications |
|
Weight |
182g |
Form
Factor |
HHHL
(CEM3.0) |
Interface |
PCIe
NVMe 3.1 x4 |
|
|
Advanced
Technologies |
|
Enhanced
Power Loss Data Protection |
Yes |
Hardware
Encryption |
AES
256 bit |
–High
Endurance Technology (HET) |
Yes |
Temperature
Monitoring and Logging |
Yes |
End-to-End
Data Protection |
Yes |
Intel®
Smart Response Technology |
No |
Intel®
Rapid Start Technology |
No |
Intel®
Remote Secure Erase |
No |