HX432S20IBK2/32 | Kingston 32GB (16GB 2G x 64-Bit x 2 pcs.) DDR4-3200 CL20 260-Pin

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Kingston 32GB (16GB 2G x 64-Bit x 2 pcs.) DDR4-3200 CL20 260-Pin SODIMM Kit

No Longer Available

Part Number:

448890

(?) Brand:

Kingston Web Site

Manuf No:

HX432S20IBK2/32

Shipping Weight:

0.1 KG (Includes product packaging)
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Date Added:

18/9/2019

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All stock codes associated to this product

HX432S20IBK2/32, 4149273, 740617277197

Stay ahead of the curve with powerful DDR4 SODIMM.

Get your notebook or small form factor machine fully equipped with HyperX Impact DDR4 SODIMM and minimize system lag. Ready for AMD Ryzen and Intel XMP-ready in capacities up to 64GB, Plug N Play HyperX Impact DDR4 automatically overclocks to the highest frequency published, up to 3200MHz*, to support Intel and AMDs latest CPU technologies. Slot in the sleek black PCB for a hassle-free boost, no need to tinker with the BIOS. Upgrade your systems performance and still run cool, quiet, and efficiently, thanks to HyperX Impact DDR4s low 1.2 voltage.

* HyperX Plug N Play memory will run in DDR4 systems up to the speed allowed by the manufacturers system BIOS. PnP cannot increase the system memory speed faster than is allowed by the manufacturers BIOS. HyperX Plug N Play DDR4 products support XMP 2.0 specifications so overclocking can also be achieved by enabling the built-in XMP Profile.

Specifications

Design
JEDEC standard	Yes
Memory
Intel Extreme Memory Profile (XMP)	Yes
Internal memory	32 GB
Internal memory type	DDR4
Memory clock speed	3200 MHz
Component for	Notebook
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 16 GB
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Programming power voltage (VPP)	2.5 V
Features
Intel Extreme Memory Profile (XMP)	Yes
Internal memory	32 GB
Internal memory type	DDR4
Memory clock speed	3200 MHz
Component for	Notebook
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 16 GB
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Operational conditions
Operating temperature (T-T)	0 - 85 C
Storage temperature (T-T)	-55 - 100 C
Weight &dimensions
Width	69.6 mm
Height	30 mm
Package width	95.5 mm
Package depth	13.9 mm
Package height	54.1 mm
Package weight	40.3 g

No additional files, specification sheets, guides or documentation found for product.

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