All stock codes associated to this product
DK.06GAk.F9NK3, DK06GAkF9NK3, AP56080
Giant II Triple Channel DDR3-1600 Overclocking Memory
Overview
Apacer has announced its brand-new "Giant II DDR3 Overclocking Memory Module series" in response to the global trend of gaming economics, helping fervent gaming players build their ultra-speed gaming PC. Apacer''s "Giant II DDR3 Overclocking Memory Module series" inherit the huge heatspreader design of the Giant Series and further adopt the unique "air-fall" vents for quick heat dissipation even at overclocking high temperature, maintaining great operation stability while the player can enjoy the sensational gaming experience.
Apacer's "Giant II DDR3 Overclocking Memory Module Series" selects the best-performing Elpida''s 1Gbit, 128x8 particles suited for overclocking, which are screened in the triple channel test environment using the advanced test fixture and programs under diversified parameters of voltage and time sequences. Stricter than other brands'' screening standards, the particles are further tested in the high temperature and high pressure environment for 72 hours to wash out unstable ones and ensure best overclocking performance and stability.
The much-tested "Giant II DDR3 Overclocking Memory Module Series" has four models: DDR3-1600MHz, 1866MHz, 2000MHz, and DDR3-2133, the most stable and performing model in the market, with two capacity choices: 3GB (1GBx3) and 6GB(2GBx3), to meet the different requirements of professional players who demand ultra game performance.
The Special Features of Giant II:
1. Unique " Air-Fall" Vents:
Inherit the huge heatspreader design of the Giant Series and further adopt the unique "air-fall" vents for quick heat dissipation even at overclocking high temperature, maintaining great operation stability while the player can enjoy the sensational gaming experience.
2. Designed Especially for Gaming PC
3. Supports Intel Extreme Memory Profiles (XMP)
4.Triple Channel Pack:
Designed specifically for the new platform, and use an optimized combination for low voltage requirements, high speed, and low latency to deliver optimal performance. To guarantee performance, each memory module kit uses the same IC brand, the same IC specification, the same module production lot, and are all tested for triple-channel compatibility and stability.
5. 100% Tested:
Passed the absolute tri-channel long-time run-in tests to ensure its excellent overclocking performance and absolute reliability.
6. Lifetime Warranty
Specifications
- JEDEC Standard
- DDR3 Speed Grade : 1600Mbps
- Unbuffered DIMM : 240-pin
- Memory Organization : x8 FBGA DRAM chip
- DDR3 DRAM interface : SSTL_15
- CAS latency : 9-9-9-27
- Bandwidth : 12800MB/s
- VDD voltage : 1.65V
- VDDQ voltage : 1.65V
- Serial presence detect with EEPROM.
- CB height : 1.181 inch
- RoHS Compliant
- Application : Gaming PC(Intel Core i7 CPU)
