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Kingston 8GB (4 x 2GB) PC3-12800 1600MHz DDR3 RAM - 9-9-9-27 - HyperX Blu Series

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Part Number:
199916
(?) Brand:
Kingston Web Site
Manuf No:
TBB6351561523
Shipping Weight:
0.6 KG (Includes product packaging)
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Details Files Images & Video
All stock codes associated to this product
(2x)KHX1600C9AD3B1K2/4G, (2x) KHX1600C9AD3B1K2/4G, TBB6351561523

This bundle is comprised of the following products:

1795451 x Kingston 4GB (2 x 2GB) PC3-12800 1600MHz DDR3 RAM - 9-9-9-27 - HyperX Blu Series
1795451 x Kingston 4GB (2 x 2GB) PC3-12800 1600MHz DDR3 RAM - 9-9-9-27 - HyperX Blu Series
Kingston 4GB (2 x 2GB) PC3-12800 1600MHz DDR3 RAM - 9-9-9-27 - HyperX Blu Series

Kingston 4GB (2 x 2GB) PC3-12800 1600MHz DDR3 RAM - 9-9-9-27 - HyperX Blu Series

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Product Description:

Kingston’s KHX1600C9D3B1K2/4GX is a kit of two 256M x 64-bit 2GB (2048MB) DDR3-1600MHz CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 128M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel® XMP (Extreme Memory Profiles).
Total kit capacity is 4GB. Each module kit has been tested to run at DDR3-1600MHz at a low latency timing of 9-9-9-27 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333MHz timing of 9-9-9 at 1.5V. Each 240- pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC standard electrical and mechanical specifications are as follows:
 
Features
  • JEDEC standard 1.5V } 0.075V Power Supply
  • VDDQ = 1.5V } 0.075V
  • 667MHz fCK for 1333Mb/sec/pin
  • 8 independent internal bank
  • Programmable CAS Latency: 5,6,7,8,9,10
  • Posted CAS
  • Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
  • Programmable CAS Write Latency(CWL) = 7(DDR3-1333)
  • 8-bit pre-fetch
  • Burst Length: 8 (Interleave without any limit, sequential with
    starting address g000h only), 4 with tCCD = 4 which does
    not allow seamless read or write [either on the fly using A12
    or MRS]
  • Bi-directional Differential Data Strobe
  • Internal(self) calibration : Internal self calibration through ZQ
    pin (RZQ : 240 ohm } 1%)
  • On Die Termination using ODT pin
  • Average Refresh Period 7.8us at lower than TCASE 85‹C,
    3.9us at 85‹C < TCASE . 95‹C
  • Asynchronous Reset
  • PCB : Height 1.180h (30.00mm), double sided component
Specifications
  • CL(IDD) 9 cycles
  • Row Cycle Time (tRCmin) 49.5ns (min.)
  • Refresh to Active/Refresh 110ns
  • Command Time (tRFCmin)
  • Row Active Time (tRASmin) 36ns (min.)
  • Power 1.080 W (operating per module)
  • UL Rating 94 V - 0
  • Operating Temperature 0° C to 85° C
  • Storage Temperature -55° C to +100° C
Kingston 4GB (2 x 2GB) PC3-12800 1600MHz DDR3 RAM - 9-9-9-27 - HyperX Blu Series

Kingston 4GB (2 x 2GB) PC3-12800 1600MHz DDR3 RAM - 9-9-9-27 - HyperX Blu Series

back to top

Product Description:

Kingston’s KHX1600C9D3B1K2/4GX is a kit of two 256M x 64-bit 2GB (2048MB) DDR3-1600MHz CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 128M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel® XMP (Extreme Memory Profiles).
Total kit capacity is 4GB. Each module kit has been tested to run at DDR3-1600MHz at a low latency timing of 9-9-9-27 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333MHz timing of 9-9-9 at 1.5V. Each 240- pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC standard electrical and mechanical specifications are as follows:
 
Features
  • JEDEC standard 1.5V } 0.075V Power Supply
  • VDDQ = 1.5V } 0.075V
  • 667MHz fCK for 1333Mb/sec/pin
  • 8 independent internal bank
  • Programmable CAS Latency: 5,6,7,8,9,10
  • Posted CAS
  • Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
  • Programmable CAS Write Latency(CWL) = 7(DDR3-1333)
  • 8-bit pre-fetch
  • Burst Length: 8 (Interleave without any limit, sequential with
    starting address g000h only), 4 with tCCD = 4 which does
    not allow seamless read or write [either on the fly using A12
    or MRS]
  • Bi-directional Differential Data Strobe
  • Internal(self) calibration : Internal self calibration through ZQ
    pin (RZQ : 240 ohm } 1%)
  • On Die Termination using ODT pin
  • Average Refresh Period 7.8us at lower than TCASE 85‹C,
    3.9us at 85‹C < TCASE . 95‹C
  • Asynchronous Reset
  • PCB : Height 1.180h (30.00mm), double sided component
Specifications
  • CL(IDD) 9 cycles
  • Row Cycle Time (tRCmin) 49.5ns (min.)
  • Refresh to Active/Refresh 110ns
  • Command Time (tRFCmin)
  • Row Active Time (tRASmin) 36ns (min.)
  • Power 1.080 W (operating per module)
  • UL Rating 94 V - 0
  • Operating Temperature 0° C to 85° C
  • Storage Temperature -55° C to +100° C

No additional files, specification sheets, guides or documentation found for product.

Full manufacturers warranty details are available at the manufacturers (Kingston) web site.

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