All stock codes associated to this product
, ASCMQ22G, AS-CMQ-22G
The Evolution of Cool.
The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. Supplied in a 22gram 8cc Tube
Made with micronized aluminum oxide, boron nitride and zinc oxide.
Ceramique uses a high-density layered composite of five unique shapes of thermally conductive aluminum oxide, boron nitride and zinc oxide sub-micron particles to maximize particle-to-particle contact area and thermal transfer.
This exclusive combination provides performance exceeding most metal based compounds.
Controlled triple phase viscosity.
Ceramique does not contain any silicone.Â
The suspension fluid is a proprietary mixture of advanced polysynthetic oils that provide superior performance and long-term stability.
During the system`s initial use, the heat from the CPU lowers the viscosity of the compound to enhance the filling of the microscopic valleys and ensure a minimum bond line between the heatsink and the CPU core. Then the compound thickens slightly over the next 100 to 300 hours of use to its final consistency designed for long-term stability.
(This should not be confused with conventional phase change pads that are pre-attached to many heatsinks. Those pads melt each time they get hot then re-solidify when they cool. The viscosity changes that Ceramique goes through are much more subtle and ultimately much more effective.)
Stability.
Ceramique is engineered to not separate, run, migrate, or bleed.
Electrical Insulator.
Ceramique does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive.
Temperature Limits
Peak: 40deg;C to 180deg;C
Long-Term: 40deg;C to 140deg;C
2 to 10 degrees centigrade lower CPU full load core temperatures then standard thermal compounds or thermal pads.
When measured with a calibrated thermal diode imbedded in the CPU core.
Ceramique can easily be cleaned from CPUs and heatsinks with isopropyl alcohol or any of the cleaners listed in the
