All stock codes associated to this product
HX426C16FBK4/64, 3603959, 740617257076
Kingston HX426C16FBK4/64 64GB (16GB 2G x 64-Bit x 4
pcs.) DDR4-2666 CL16 288-Pin DIMM
Description
HyperX HX426C16FBK4/64 is a kit of four 2G x 64-bit (16GB) DDR4-2666 CL16
SDRAM (Synchronous DRAM) 2Rx8, memory module, based on sixteen 1G x 8-bit FBGA
components per module. Each module kit supports Intel Extreme Memory Profiles
(Intel XMP) 2.0. Total kit capacity is 64GB. Each module has been tested to run
at DDR4-2666 at a low latency timing of 16-18-18 at 1.2V. Additional timing
parameters are shown in the Plug-N-Play (PnP) Timing Parameters section below.
The JEDEC standard electrical and mechanical specifications are as follows:
JEDEC/XMP TIMING PARAMETERS
- JEDEC/PnP: DDR4-2666 CL16-18-18 @1.2V
- XMP Profile #1: DDR4-2666 CL16-18-18 @1.2V
Features
- Power Supply: VDD = 1.2V Typical
- VDDQ = 1.2V Typical
- VPP - 2.5V Typical
- VDDSPD = 2.2V to 3.6V
- Nominal and dynamic on-die termination (ODT) for data, strobe, and mask
signals
- Low-power auto self refresh (LPASR)
- Data bus inversion (DBI) for data bus
- On-die VREFDQ generation and calibration
- Single-rank
- On-board I2 serial presence-detect (SPD) EEPROM
- 16 internal banks; 4 groups of 4 banks each
- Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode
register set (MRS)
- Selectable BC4 or BL8 on-the-fly (OTF)
- Fly-by topology
- Terminated control command and address bus
- Height 1.340 (34.04mm), w/o heatsink
Specifications
CL(IDD) |
16 cycles
|
Row Cycle Time
(tRCmin) |
45.75ns(min.) |
Refresh to
Active/Refresh |
350ns(min.)
|
Command Time
(tRFCmin) |
|
Row Active Time
(tRASmin) |
29.25ns(min.) |
Maximum Operating
Power |
TBD
W* |
UL
Rating |
94 V -
0 |
Operating
Temperature |
0 DegreeC to +85
DegreeC |
Storage
Temperature |
-55 DegreeC to +100
DegreeC |