All stock codes associated to this product
HX321C11T3K2/16, 2714949, 740617235012, 740617213621
   HX321C11T3K2/16
  
16GB (8GB 1G x 64-Bit x 2 pcs.)
  
DDR3-2133 CL11 240-Pin DIMM Kit
   
  HX321C11T3K2/16
16GB (8GB 1G x 64-Bit x 2 pcs.)
DDR3-2133 CL11 240-Pin DIMM Kit
  
DESCRIPTION
  
HyperX HX321C11T3K2/16 is a kit of two 1G x 64-bit (8GB) DDR3-2133 CL11 SDRAM (Synchronous DRAM), 2Rx8 memory modules, based on sixteen 512M x 8-bit FBGA components per module. Each module kit supports Intel® XMP (Extreme Memory Profiles). Total kit capacity is 16GB.
Each module kit has been tested to run at DDR3-2133 at alow latency timing of 11-12-12 at 1.6V. The SPDs are programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact fingers. The JEDEC standard electrical and mechanical specifications are as follows:
   
  XMP TIMING PARAMETERS
  
JEDEC: DDR3-1600 CL11-11-11 @1.5V
XMP Profile #1: DDR3-2133 CL11-12-12 @1.6V
XMP Profile #2: DDR3-1600 CL9-9-9 @1.5V
   
  FEATURES
   
  
    - JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply VDDQ = 1.5V (1.425V ~ 1.575V)
 
    - 800MHz fCK for 1600Mb/sec/pin
 
    - 8 independent internal bank
 
    - Programmable CAS Latency: 11, 10, 9, 8, 7, 6
 
    - Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
 
    - 8-bit pre-fetch
 
    - Burst Length: 8 (Interleave without any limit, sequential with starting address 000 only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
 
    - Bi-directional Differential Data Strobe Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm 1%)
 
    - On Die Termination using ODT pin 
 
    - Average Refresh Period 7.8us at lower than TCASE 85C, 3.9us at 85C < TCASE < 95C
 
    - Asynchronous Reset
 
    - Height 1.827 (46.41mm) w/ heatsink, double sided component
 
  
   
  SPECIFICATIONS
   
  
    - CL(IDD): 11 Cycles
 
    - Row Cycle Time (tRCmin): 48.125ns (min.)
 
    - Refresh to Active/Refresh, Command Time (tRFCmin): 260ns (min.)
 
    - Row Active Time (tRASmin): 35ns (min.)
 
    - Maximum Operating Power: TBD W* (per module)
 
    - UL Rating: 94 V - 0
 
    - Operating Temperature: 0oC to 85oC
 
    - Storage Temperature: -55oC to +100oC
 
  
   
  Power will vary depending on the SDRAM used.